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1. Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong.

by Tong, Xingcun Colin | SpringerLink (Online service).

Edition: 1.Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: New York, NY : Springer New York, 2011Online access: Click here to access online Availability: No items available
2. Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong.

by Tong, Xingcun Colin [author.] | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: New York, NY : Springer New York : Imprint: Springer, 2011Online access: Click here to access online Availability: No items available

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