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Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong.

By: Tong, Xingcun Colin.
Contributor(s): SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: Springer Series in Advanced Microelectronics, 30.Publisher: New York, NY : Springer New York, 2011Edition: 1.Description: digital.ISBN: 9781441977595.Subject(s): Physics | Engineering | Electronics | Optical materials | Physics | Electronic Circuits and Devices | Optical and Electronic Materials | Engineering Thermodynamics, Heat and Mass Transfer | Electronics and Microelectronics, InstrumentationDDC classification: 621.3815 Online resources: Click here to access online In: Springer eBooks
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