Tong, Xingcun Colin.
Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong. - 1. - New York, NY : Springer New York, 2011. - digital. - Springer Series in Advanced Microelectronics, 30 1437-0387 ; . - Springer Series in Advanced Microelectronics, 30 .
9781441977595
10.1007/978-1-4419-7759-5 doi
Physics.
Engineering.
Electronics.
Optical materials.
Physics.
Electronic Circuits and Devices.
Optical and Electronic Materials.
Engineering Thermodynamics, Heat and Mass Transfer.
Electronics and Microelectronics, Instrumentation.
TK7867-7867.5
621.3815
Advanced Materials for Thermal Management of Electronic Packaging [electronic resource] / by Xingcun Colin Tong. - 1. - New York, NY : Springer New York, 2011. - digital. - Springer Series in Advanced Microelectronics, 30 1437-0387 ; . - Springer Series in Advanced Microelectronics, 30 .
9781441977595
10.1007/978-1-4419-7759-5 doi
Physics.
Engineering.
Electronics.
Optical materials.
Physics.
Electronic Circuits and Devices.
Optical and Electronic Materials.
Engineering Thermodynamics, Heat and Mass Transfer.
Electronics and Microelectronics, Instrumentation.
TK7867-7867.5
621.3815