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1. Materials for Advanced Packaging [electronic resource] / edited by Daniel Lu, C.P. Wong.

by Lu, Daniel | Wong, C.P | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Boston, MA : Springer US, 2009Online access: Click here to access online Availability: No items available
2. Electrical Conductive Adhesives with Nanotechnologies [electronic resource] / by Yi Li, Daniel Lu, C. P. Wong.

by Li, Yi | Lu, Daniel | Wong, C. P | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Boston, MA : Springer US, 2010Online access: Click here to access online Availability: No items available
3. Electrical Conductive Adhesives with Nanotechnologies [electronic resource] / by Yi Li, Daniel Lu, C. P. Wong.

by Li, Yi [author.] | Lu, Daniel [author.] | Wong, C. P [author.] | SpringerLink (Online service).

Source: Springer eBooksMaterial type: book Book; Format: electronic available online remote; Literary form: Not fiction Publisher: Boston, MA : Springer US, 2010Online access: Click here to access online Availability: No items available

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