Materials for Advanced Packaging [electronic resource] / edited by Daniel Lu, C.P. Wong.
By: Lu, Daniel.
Contributor(s): Wong, C.P | SpringerLink (Online service).
Material type:
BookPublisher: Boston, MA : Springer US, 2009Description: digital.ISBN: 9780387782195.Subject(s): Electronics | Optical materials | Nanotechnology | Materials | Materials Science | Optical and Electronic Materials | Metallic Materials | Nanotechnology | Electronics and Microelectronics, InstrumentationDDC classification: 620.11295 | 620.11297 Online resources: Click here to access online
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