000			03889nam a22005055i 4500
001			978-3-319-00122-7
003			DE-He213
005			20140220082837.0
007			cr nn 008mamaa
008			130604s2013 gw | s |||| 0|eng d
020			_a9783319001227 _9978-3-319-00122-7
024	7		_a10.1007/978-3-319-00122-7 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTEC008070 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aMcPherson, J. W. _eauthor.
245	1	0	_aReliability Physics and Engineering _h[electronic resource] : _bTime-To-Failure Modeling / _cby J. W. McPherson.
250			_a2nd ed. 2013.
264		1	_aHeidelberg : _bSpringer International Publishing : _bImprint: Springer, _c2013.
300			_aXVI, 399 p. 171 illus., 124 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aIntroduction -- Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics – An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits Breakdown (TDDB) -- Time-To-Failure Models for Selected Failure Mechanisms In Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals -- Appendix A: Useful Conversion Factors -- Appendix B: Useful Physical Constants -- Appendix C: Useful Rough Rules-Of-Thumb -- Appendix D: Useful Mathematical Expressions -- Appendix E: Useful Differentials and Definite Integrals -- Appendix F: Free-Energy -- Appendix G: t(1-α/2,ν) Distribution Values -- Appendix H: χ2(P,ν) Distribution Values -- Index.
520			_aReliability Physics and Engineering provides critically important information that is needed for designing and building reliable cost-effective products. Key features include:  ·       Materials/Device Degradation ·       Degradation Kinetics ·       Time-To-Failure Modeling ·       Statistical Tools ·       Failure-Rate Modeling ·       Accelerated Testing ·       Ramp-To-Failure Testing ·       Important Failure Mechanisms for Integrated Circuits ·       Important Failure Mechanisms for  Mechanical Components ·       Conversion of Dynamic  Stresses into Static Equivalents ·       Small Design Changes Producing Major Reliability Improvements ·       Screening Methods ·       Heat Generation and Dissipation ·       Sampling Plans and Confidence Intervals This textbook includes numerous example problems with solutions. Also, exercise problems along with the answers are included at the end of each chapter. Reliability Physics and Engineering can be a very useful resource for students, engineers, and materials scientists.
650		0	_aEngineering.
650		0	_aMathematical statistics.
650		0	_aSystem safety.
650		0	_aElectronics.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aQuality Control, Reliability, Safety and Risk.
650	2	4	_aStatistical Theory and Methods.
650	2	4	_aEnergy, general.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9783319001210
856	4	0	_uhttp://dx.doi.org/10.1007/978-3-319-00122-7
912			_aZDB-2-ENG
999			_c96358 _d96358