000 03091nam a22004815i 4500
001 978-1-4614-6473-0
003 DE-He213
005 20140220082825.0
007 cr nn 008mamaa
008 130402s2013 xxu| s |||| 0|eng d
020 _a9781461464730
_9978-1-4614-6473-0
024 7 _a10.1007/978-1-4614-6473-0
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aKashmiri, S. Mahdi.
_eauthor.
245 1 0 _aElectrothermal Frequency References in Standard CMOS
_h[electronic resource] /
_cby S. Mahdi Kashmiri, Kofi A. A. Makinwa.
264 1 _aNew York, NY :
_bSpringer New York :
_bImprint: Springer,
_c2013.
300 _aIX, 214 p. 161 illus., 35 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aAnalog Circuits and Signal Processing
505 0 _aIntroduction -- Silicon-based Frequency References -- Frequency References  Based on the Thermal Properties of Silicon.-A Digitally-Assisted Electrothermal Frequency-Locked Loop in Standard CMOS -- An Electrothermal Frequency Reference in Standard 0.7µm CMOS -- A Scaled Electrothermal Frequency Reference in Standard 0.16µm CMOS -- Conclusions and Outlook -- Appendix.
520 _aThis book describes an alternative method of accurate on-chip frequency generation in standard CMOS IC processes. This method exploits the thermal-diffusivity of silicon, the rate at which heat diffuses through a silicon substrate.  This is the first book describing thermal-diffusivity-based frequency references, including the complete theoretical methodology supported by practical realizations that prove the feasibility of the method.  Coverage also includes several circuit and system-level solutions for the analog electronic circuit design challenges faced.   ·         Surveys the state-of-the-art in all-silicon frequency references; ·         Examines the thermal properties of silicon as a solution for the challenge of on-chip accurate frequency generation; ·         Uses simplified modeling approaches that allow an electronics engineer easily to simulate the electrothermal elements; ·         Follows a top-down methodology in circuit design, in which system-level design is promoted by behavioral simulations.
650 0 _aEngineering.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aSignal, Image and Speech Processing.
700 1 _aMakinwa, Kofi A. A.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781461464723
830 0 _aAnalog Circuits and Signal Processing
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4614-6473-0
912 _aZDB-2-ENG
999 _c95678
_d95678