000			03785nam a22004935i 4500
001			978-1-4614-1963-1
003			DE-He213
005			20140220082811.0
007			cr nn 008mamaa
008			120913s2013 xxu| s |||| 0|eng d
020			_a9781461419631 _9978-1-4614-1963-1
024	7		_a10.1007/978-1-4614-1963-1 _2doi
050		4	_aT58.8
072		7	_aTH _2bicssc
072		7	_aTEC031000 _2bisacsh
072		7	_aTEC009020 _2bisacsh
082	0	4	_a658.26 _223
100	1		_aJiang, Guosheng. _eauthor.
245	1	0	_aAdvanced Thermal Management Materials _h[electronic resource] / _cby Guosheng Jiang, Liyong Diao, Ken Kuang.
264		1	_aNew York, NY : _bSpringer New York : _bImprint: Springer, _c2013.
300			_aVIII, 156 p. 72 illus., 29 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aIntroduction to Thermal Management in Microelectronics Packaging -- Requirements of Thermal Management Materials -- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials -- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies -- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications --  Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications -- Al/SiC Thermal Management Materials -- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper -- Future Trend of Advanced Thermal Management Materials.
520			_aAdvanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aMaterials.
650	1	4	_aEnergy.
650	2	4	_aEnergy Efficiency (incl. Buildings).
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aEngineering Thermodynamics, Heat and Mass Transfer.
650	2	4	_aMetallic Materials.
700	1		_aDiao, Liyong. _eauthor.
700	1		_aKuang, Ken. _eauthor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781461419624
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4614-1963-1
912			_aZDB-2-ENE
999			_c94930 _d94930