| 000 | 02812nam a22004575i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4614-1761-3 | ||
| 003 | DE-He213 | ||
| 005 | 20140220082457.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 131005s2014 xxu| s |||| 0|eng d | ||
| 020 |
_a9781461417613 _9978-1-4614-1761-3 |
||
| 024 | 7 |
_a10.1007/978-1-4614-1761-3 _2doi |
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| 050 | 4 | _aTK7888.4 | |
| 072 | 7 |
_aTJFC _2bicssc |
|
| 072 | 7 |
_aTEC008010 _2bisacsh |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aBalasinski, Artur. _eauthor. |
|
| 245 | 1 | 0 |
_aDesign for Manufacturability _h[electronic resource] : _bFrom 1D to 4D for 90–22 nm Technology Nodes / _cby Artur Balasinski. |
| 264 | 1 |
_aNew York, NY : _bSpringer New York : _bImprint: Springer, _c2014. |
|
| 300 |
_aVIII, 278 p. 214 illus., 45 illus. in color. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aPreface -- Classic DfM: from 2D to 3D -- DfM at 28 nm and Beyond -- New DfM Domain: Stress Effects -- Conclusions and Future Work. | |
| 520 | _aThis book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. · Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm technology nodes; · Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package; · Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; · Helps readers to translate reliability methodology into real design flows. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aSystem safety. | |
| 650 | 0 | _aElectronics. | |
| 650 | 0 | _aSystems engineering. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aCircuits and Systems. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aQuality Control, Reliability, Safety and Risk. |
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9781461417606 |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4614-1761-3 |
| 912 | _aZDB-2-ENG | ||
| 999 |
_c91945 _d91945 |
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