000			01468nam a22004215i 4500
001			978-3-540-26945-8
003			DE-He213
005			20130515021240.0
007			cr nn 008mamaa
008			100301s2005 gw | s |||| 0|eng d
020			_a9783540269458 _9978-3-540-26945-8
024	7		_a10.1007/b138345 _2doi
100	1		_aSchwizer, Jürg.
245	1	0	_aForce Sensors for Microelectronic Packaging Applications _h[electronic resource] / _cby Jürg Schwizer, Michael Mayer, Oliver Brand.
260			_aBerlin, Heidelberg : _bSpringer Berlin Heidelberg, _c2005.
300			_bdigital.
490	0		_aMicrotechnology and MEMS, _x1615-8326
650		0	_aChemistry.
650		0	_aSystem safety.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aNanotechnology.
650	1	4	_aChemistry.
650	2	4	_aNanotechnology.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aPhysics and Applied Physics in Engineering.
650	2	4	_aQuality Control, Reliability, Safety and Risk.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
700	1		_aMayer, Michael.
700	1		_aBrand, Oliver.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9783540221876
830		0	_aMicrotechnology and MEMS, _x1615-8326
856	4	0	_uhttp://dx.doi.org/10.1007/b138345
912			_aZDB-2-CMS
999			_c75450 _d75450