000			01582nam a22004335i 4500
001			978-1-84628-235-5
003			DE-He213
005			20130515021132.0
007			cr nn 008mamaa
008			100301s2005 xxk| s |||| 0|eng d
020			_a9781846282355 _9978-1-84628-235-5
024	7		_a10.1007/1-84628-235-7 _2doi
100	1		_aZschech, Ehrenfried.
245	1	0	_aMaterials for Information Technology _h[electronic resource] : _bDevices, Interconnects and Packaging / _cedited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.
260			_aLondon : _bSpringer London, _c2005.
300			_bdigital.
490	0		_aEngineering Materials and Processes, _x1619-0181
650		0	_aEngineering.
650		0	_aParticles (Nuclear physics).
650		0	_aElectronics.
650		0	_aMaterials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aPhysics and Applied Physics in Engineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aSolid State Physics and Spectroscopy.
650	2	4	_aCeramics, Glass, Composites, Natural Methods.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aMetallic Materials.
700	1		_aWhelan, Caroline.
700	1		_aMikolajick, Thomas.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781852339418
830		0	_aEngineering Materials and Processes, _x1619-0181
856	4	0	_uhttp://dx.doi.org/10.1007/1-84628-235-7
912			_aZDB-2-ENG
999			_c74165 _d74165