000			01496nam a22004335i 4500
001			978-1-4419-7759-5
003			DE-He213
005			20130515021056.0
007			cr nn 008mamaa
008			110105s2011 xxu| s |||| 0|eng d
020			_a9781441977595 _9978-1-4419-7759-5
024	7		_a10.1007/978-1-4419-7759-5 _2doi
050		4	_aTK7867-7867.5
072		7	_aTJFC _2bicssc
072		7	_aTEC008010 _2bisacsh
082	0	4	_a621.3815 _223
100	1		_aTong, Xingcun Colin.
245	1	0	_aAdvanced Materials for Thermal Management of Electronic Packaging _h[electronic resource] / _cby Xingcun Colin Tong.
250			_a1.
260			_aNew York, NY : _bSpringer New York, _c2011.
300			_bdigital.
490	0		_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v30
650		0	_aPhysics.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aOptical materials.
650	1	4	_aPhysics.
650	2	4	_aElectronic Circuits and Devices.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aEngineering Thermodynamics, Heat and Mass Transfer.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781441977588
830		0	_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v30
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4419-7759-5
912			_aZDB-2-ENG
999			_c73440 _d73440