000			01404nam a22004215i 4500
001			978-1-4419-5719-1
003			DE-He213
005			20130515021031.0
007			cr nn 008mamaa
008			100721s2010 xxu| s |||| 0|eng d
020			_a9781441957191 _9978-1-4419-5719-1
024	7		_a10.1007/978-1-4419-5719-1 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aFan, X.J.
245	1	0	_aMoisture Sensitivity of Plastic Packages of IC Devices _h[electronic resource] / _cedited by X.J. Fan, E. Suhir.
260			_aBoston, MA : _bSpringer US, _c2010.
300			_bdigital.
490	0		_aMicro- and Opto-Electronic Materials, Structures, and Systems
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aOptical materials.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aEngineering, general.
700	1		_aSuhir, E.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781441957184
830		0	_aMicro- and Opto-Electronic Materials, Structures, and Systems
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4419-5719-1
912			_aZDB-2-ENG
999			_c72993 _d72993