000 01333nam a22004215i 4500
001 978-1-4419-0984-8
003 DE-He213
005 20130515021019.0
007 cr nn 008mamaa
008 100301s2010 xxu| s |||| 0|eng d
020 _a9781441909848
_9978-1-4419-0984-8
024 7 _a10.1007/978-1-4419-0984-8
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
082 0 4 _a621.381
_223
100 1 _aKuang, Ken.
245 1 0 _aRF and Microwave Microelectronics Packaging
_h[electronic resource] /
_cedited by Ken Kuang, Franklin Kim, Sean S. Cahill.
260 _aBoston, MA :
_bSpringer US,
_c2010.
300 _bdigital.
650 0 _aEngineering.
650 0 _aMicrowaves.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aMicrowaves, RF and Optical Engineering.
650 2 4 _aCircuits and Systems.
700 1 _aKim, Franklin.
700 1 _aCahill, Sean S.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441909831
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-0984-8
912 _aZDB-2-ENG
999 _c72765
_d72765