000			01545nam a22004575i 4500
001			978-1-4419-0784-4
003			DE-He213
005			20130515021017.0
007			cr nn 008mamaa
008			100301s2010 xxu| s |||| 0|eng d
020			_a9781441907844 _9978-1-4419-0784-4
024	7		_a10.1007/978-1-4419-0784-4 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aXie, Yuan.
245	1	0	_aThree Dimensional Integrated Circuit Design _h[electronic resource] : _bEDA, Design and Microarchitectures / _cedited by Yuan Xie, Jason Cong, Sachin Sapatnekar.
260			_aBoston, MA : _bSpringer US, _c2010.
300			_bdigital.
490	0		_aIntegrated Circuits and Systems, _x1558-9412
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aEngineering, general.
700	1		_aCong, Jason.
700	1		_aSapatnekar, Sachin.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781441907837
830		0	_aIntegrated Circuits and Systems, _x1558-9412
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4419-0784-4
912			_aZDB-2-ENG
999			_c72723 _d72723