000			01567nam a22004575i 4500
001			978-1-4020-4589-9
003			DE-He213
005			20130515020751.0
007			cr nn 008mamaa
008			100301s2006 ne | s |||| 0|eng d
020			_a9781402045899 _9978-1-4020-4589-9
024	7		_a10.1007/1-4020-4589-1 _2doi
050		4	_aTA405-409.3
050		4	_aQA808.2
072		7	_aTG _2bicssc
072		7	_aTEC009070 _2bisacsh
082	0	4	_a620.1 _223
100	1		_aDziuban, Jan A.
245	1	0	_aBonding in Microsystem Technology _h[electronic resource] / _cby Jan A. Dziuban.
260			_aDordrecht : _bSpringer Netherlands, _c2006.
300			_bdigital.
490	0		_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v24
650		0	_aEngineering.
650		0	_aMaterials.
650		0	_aStructural control (Engineering).
650		0	_aElectronics.
650		0	_aOptical materials.
650	1	4	_aEngineering.
650	2	4	_aContinuum Mechanics and Mechanics of Materials.
650	2	4	_aPhysics and Applied Physics in Engineering.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOperating Procedures, Materials Treatment.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781402045783
830		0	_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v24
856	4	0	_uhttp://dx.doi.org/10.1007/1-4020-4589-1
912			_aZDB-2-ENG
999			_c69903 _d69903