000			01494nam a22004335i 4500
001			978-0-85729-236-0
003			DE-He213
005			20130515020700.0
007			cr nn 008mamaa
008			110512s2011 xxk| s |||| 0|eng d
020			_a9780857292360 _9978-0-85729-236-0
024	7		_a10.1007/978-0-85729-236-0 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aGrossmann, Günter.
245	1	4	_aThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects _h[electronic resource] / _cedited by Günter Grossmann, Christian Zardini.
260			_aLondon : _bSpringer London, _c2011.
300			_bdigital.
650		0	_aEngineering.
650		0	_aSystem safety.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aQuality Control, Reliability, Safety and Risk.
650	2	4	_aCharacterization and Evaluation of Materials.
700	1		_aZardini, Christian.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780857292353
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-85729-236-0
912			_aZDB-2-ENG
999			_c69018 _d69018