000			01450nam a22004695i 4500
001			978-0-387-88783-8
003			DE-He213
005			20130515020631.0
007			cr nn 008mamaa
008			100715s2010 xxu| s |||| 0|eng d
020			_a9780387887838 _9978-0-387-88783-8
024	7		_a10.1007/978-0-387-88783-8 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aLi, Yi.
245	1	0	_aElectrical Conductive Adhesives with Nanotechnologies _h[electronic resource] / _cby Yi Li, Daniel Lu, C. P. Wong.
260			_aBoston, MA : _bSpringer US, _c2010.
300			_bdigital.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aSystems engineering.
650		0	_aMaterials.
650		0	_aOptical materials.
650		0	_aNanotechnology.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aNanotechnology.
650	2	4	_aCircuits and Systems.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aMaterials Science, general.
700	1		_aLu, Daniel.
700	1		_aWong, C. P.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387887821
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-88783-8
912			_aZDB-2-ENG
999			_c68545 _d68545