000			01258nam a22003735i 4500
001			978-0-387-79394-8
003			DE-He213
005			20130515020618.0
007			cr nn 008mamaa
008			110402s2009 xxu| s |||| 0|eng d
020			_a9780387793948 _9978-0-387-79394-8
024	7		_a10.1007/978-0-387-79394-8 _2doi
100	1		_aPerkins, Andrew E.
245	1	0	_aSolder Joint Reliability Prediction for Multiple Environments _h[electronic resource] / _cby Andrew E. Perkins, Suresh K. Sitaraman.
260			_aBoston, MA : _bSpringer US, _c2009.
300			_bdigital.
650		0	_aEngineering.
650		0	_aSystem safety.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aMaterials.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aMetallic Materials.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aQuality Control, Reliability, Safety and Risk.
700	1		_aSitaraman, Suresh K.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387793931
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-79394-8
912			_aZDB-2-ENG
999			_c68343 _d68343