000 01323nam a22004215i 4500
001 978-0-387-78219-5
003 DE-He213
005 20130515020612.0
007 cr nn 008mamaa
008 100301s2009 xxu| s |||| 0|eng d
020 _a9780387782195
_9978-0-387-78219-5
024 7 _a10.1007/978-0-387-78219-5
_2doi
050 4 _aTA1750-1750.22
072 7 _aTJFD
_2bicssc
072 7 _aTEC021000
_2bisacsh
082 0 4 _a620.11295
_223
082 0 4 _a620.11297
_223
100 1 _aLu, Daniel.
245 1 0 _aMaterials for Advanced Packaging
_h[electronic resource] /
_cedited by Daniel Lu, C.P. Wong.
260 _aBoston, MA :
_bSpringer US,
_c2009.
300 _bdigital.
650 0 _aElectronics.
650 0 _aOptical materials.
650 0 _aNanotechnology.
650 0 _aMaterials.
650 1 4 _aMaterials Science.
650 2 4 _aOptical and Electronic Materials.
650 2 4 _aMetallic Materials.
650 2 4 _aNanotechnology.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
700 1 _aWong, C.P.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9780387782188
856 4 0 _uhttp://dx.doi.org/10.1007/978-0-387-78219-5
912 _aZDB-2-CMS
999 _c68248
_d68248