| 000 | 00922pam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | 1037295 | ||
| 005 | 20130515014333.0 | ||
| 008 | 890310s1989 paua b 001 0 eng | ||
| 010 | _a 89031855 | ||
| 020 |
_a0830632034 : _c$44.50 |
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| 040 |
_aDLC _cDLC _dDLC |
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| 050 | 0 | 0 |
_aTT267 _b.J68 1989 |
| 082 | 0 | 0 |
_a671.5/6 _220 |
| 100 | 1 |
_aJohnson, Colin C. _98364 |
|
| 245 | 1 | 0 |
_aSolder paste technology : _bprinciples and applications / _cColin C. Johnson and Joseph Kevra. |
| 260 |
_aBlue Ridge Summit, PA : _bTAB Professional and Reference Books, _cc1989. |
||
| 300 |
_axvii, 286 p. : _bill. ; _c24 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aSolder pastes. _98365 |
|
| 700 | 1 |
_aKevra, Joseph. _98366 |
|
| 906 |
_a7 _bcbc _corignew _d1 _eocip _f19 _gy-gencatlg |
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| 942 |
_2lcc _cBK _hTT267 |
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| 999 |
_c18319 _d18319 |
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