| 000 | 02543cam a2200517Ii 4500 | ||
|---|---|---|---|
| 001 | 9780429460470 | ||
| 003 | FlBoTFG | ||
| 005 | 20220509193029.0 | ||
| 006 | m o d | ||
| 007 | cr cnu|||unuuu | ||
| 008 | 210113s2021 flua ob 001 0 eng d | ||
| 040 |
_aOCoLC-P _beng _erda _epn _cOCoLC-P |
||
| 020 |
_a9780429460470 _q(electronic bk.) |
||
| 020 |
_a0429460473 _q(electronic bk.) |
||
| 020 |
_a9780429863820 _q(electronic bk. : PDF) |
||
| 020 |
_a0429863829 _q(electronic bk. : PDF) |
||
| 020 |
_a9780429863813 _q(electronic bk. : EPUB) |
||
| 020 |
_a0429863810 _q(electronic bk. : EPUB) |
||
| 020 |
_a9780429863806 _q(electronic bk. : Mobipocket) |
||
| 020 |
_a0429863802 _q(electronic bk. : Mobipocket) |
||
| 020 | _z9780367635886 | ||
| 035 | _a(OCoLC)1230505342 | ||
| 035 | _a(OCoLC-P)1230505342 | ||
| 050 | 4 |
_aTK7874.53 _b.S84 2021eb |
|
| 072 | 7 |
_aTEC _x008000 _2bisacsh |
|
| 072 | 7 |
_aTEC _x021000 _2bisacsh |
|
| 072 | 7 |
_aTJFN _2bicssc |
|
| 082 | 0 | 4 |
_a621.3815 _223 |
| 100 | 1 |
_aSuhir, Ephraim, _eauthor. |
|
| 245 | 1 | 0 |
_aAvoiding inelastic strains in solder joint interconnections of IC devices / _cauthored by: Ephraim Suhir. |
| 250 | _aFirst edition. | ||
| 264 | 1 |
_aBoca Raton, FL : _bCRC Press, _c2020. |
|
| 300 |
_a1 online resource : _billustrations |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
||
| 520 |
_a"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- _cProvided by publisher. |
||
| 588 | _aOCLC-licensed vendor bibliographic record. | ||
| 650 | 0 |
_aInterconnects (Integrated circuit technology) _xProtection. |
|
| 650 | 0 |
_aSolder and soldering _xMechanical properties _xMathematical models. |
|
| 650 | 0 | _aFailure analysis (Engineering) | |
| 650 | 7 |
_aTECHNOLOGY / Electronics / General _2bisacsh |
|
| 650 | 7 |
_aTECHNOLOGY / Material Science _2bisacsh |
|
| 650 | 0 | _aElectronic books. | |
| 856 | 4 | 0 |
_3Taylor & Francis _uhttps://www.taylorfrancis.com/books/9780429460470 |
| 856 | 4 | 2 |
_3OCLC metadata license agreement _uhttp://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf |
| 999 |
_c128533 _d128533 |
||