000 02674nam a22004335i 4500
001 978-1-4419-7276-7
003 DE-He213
005 20140220083723.0
007 cr nn 008mamaa
008 101118s2011 xxu| s |||| 0|eng d
020 _a9781441972767
_9978-1-4419-7276-7
024 7 _a10.1007/978-1-4419-7276-7
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aBurghartz, Joachim.
_eeditor.
245 1 0 _aUltra-thin Chip Technology and Applications
_h[electronic resource] /
_cedited by Joachim Burghartz.
264 1 _aNew York, NY :
_bSpringer New York :
_bImprint: Springer,
_c2011.
300 _aXXII, 467p. 252 illus., 157 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aFabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications.
520 _aUltra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.
650 0 _aEngineering.
650 0 _aComputer aided design.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aComputer-Aided Engineering (CAD, CAE) and Design.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441972750
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-7276-7
912 _aZDB-2-ENG
999 _c105727
_d105727