| 000 | 03329nam a22005655i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4419-5760-3 | ||
| 003 | DE-He213 | ||
| 005 | 20140220083720.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 110204s2011 xxu| s |||| 0|eng d | ||
| 020 |
_a9781441957603 _9978-1-4419-5760-3 |
||
| 024 | 7 |
_a10.1007/978-1-4419-5760-3 _2doi |
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| 050 | 4 | _aTK7800-8360 | |
| 050 | 4 | _aTK7874-7874.9 | |
| 072 | 7 |
_aTJF _2bicssc |
|
| 072 | 7 |
_aTEC008000 _2bisacsh |
|
| 072 | 7 |
_aTEC008070 _2bisacsh |
|
| 082 | 0 | 4 |
_a621.381 _223 |
| 100 | 1 |
_aLiu, Johan. _eauthor. |
|
| 245 | 1 | 0 |
_aReliability of Microtechnology _h[electronic resource] : _bInterconnects, Devices and Systems / _cby Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson. |
| 250 | _a1. | ||
| 264 | 1 |
_aNew York, NY : _bSpringer New York, _c2011. |
|
| 300 |
_aXIII, 204p. 50 illus. _bonline resource. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_acomputer _bc _2rdamedia |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
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| 505 | 0 | _aIntroduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis. | |
| 520 | _aReliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes�quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aSystem safety. | |
| 650 | 0 | _aElectronics. | |
| 650 | 0 | _aOptical materials. | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 650 | 2 | 4 | _aQuality Control, Reliability, Safety and Risk. |
| 650 | 2 | 4 | _aNanotechnology and Microengineering. |
| 700 | 1 |
_aSalmela, Olli. _eauthor. |
|
| 700 | 1 |
_aSarkka, Jussi. _eauthor. |
|
| 700 | 1 |
_aMorris, James E. _eauthor. |
|
| 700 | 1 |
_aTegehall, Per-Erik. _eauthor. |
|
| 700 | 1 |
_aAndersson, Cristina. _eauthor. |
|
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9781441957597 |
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4419-5760-3 |
| 912 | _aZDB-2-ENG | ||
| 999 |
_c105560 _d105560 |
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