000 03910nam a22004455i 4500
001 978-1-4419-0962-6
003 DE-He213
005 20140220083719.0
007 cr nn 008mamaa
008 101207s2011 xxu| s |||| 0|eng d
020 _a9781441909626
_9978-1-4419-0962-6
024 7 _a10.1007/978-1-4419-0962-6
_2doi
050 4 _aNA2543.B84
072 7 _aAMC
_2bicssc
072 7 _aARC009000
_2bisacsh
082 0 4 _a720
_223
100 1 _aPapanikolaou, Antonis.
_eeditor.
245 1 0 _aThree Dimensional System Integration
_h[electronic resource] :
_bIC Stacking Process and Design /
_cedited by Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic.
264 1 _aBoston, MA :
_bSpringer US,
_c2011.
300 _aVIII, 246p. 100 illus.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aThe next step in system integration: the benefits of going 3-D -- Process technology for manufacturing Through-Silicon Vias (TSVs) -- Alternative 3D integration schemes -- Manufacturing issues in 3D stacked ICs -- TSV characterization -- Physical design of 3D stacked ICs -- DRAM on logic stacking -- 3D general purpose micro-processors -- 3D system design: a holistic design approach.
520 _aThree Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.
650 0 _aArchitecture.
650 0 _aSystems engineering.
650 1 4 _aArchitecture.
650 2 4 _aBasics of Construction.
650 2 4 _aCircuits and Systems.
700 1 _aSoudris, Dimitrios.
_eeditor.
700 1 _aRadojcic, Riko.
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441909619
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-0962-6
912 _aZDB-2-ENG
999 _c105516
_d105516