000			03529nam a22005055i 4500
001			978-1-4614-0463-7
003			DE-He213
005			20140220083238.0
007			cr nn 008mamaa
008			111013s2012 xxu| s |||| 0|eng d
020			_a9781461404637 _9978-1-4614-0463-7
024	7		_a10.1007/978-1-4614-0463-7 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTEC008070 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aPang, John Hock Lye. _eauthor.
245	1	0	_aLead Free Solder _h[electronic resource] : _bMechanics and Reliability / _cby John Hock Lye Pang.
264		1	_aNew York, NY : _bSpringer New York, _c2012.
300			_aX, 175p. 162 illus. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aIntroduction -- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models -- Fatigue Life Prediction Models -- Finite Element Analysis and Design-For-Reliability -- Thermo-Mechanical Reliability Test and Analysis -- Dynamic Mechanical Reliability Test and Analysis -- Thermal Cycling Aging Effects on Board-Level Drop Test Result.
520			_aLead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical properties  of the lead-free solder materials used in the industry Focuses on mechanics of materials theory inelastic, plastic, creep, fatigue and fracture assessments Presents materials testing and characterization for bulk solder, solder joint and soldered assembly Details how to use  reliability test and analysis for thermal cycling, cyclic bending and drop impact Lead Free Solder: Mechanics and Reliability is an ideal book for engineers working with semiconductor packaging and in the electronic manufacturing industry.
650		0	_aEngineering.
650		0	_aMaterials.
650		0	_aElectronics.
650		0	_aSystems engineering.
650		0	_aOptical materials.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aContinuum Mechanics and Mechanics of Materials.
650	2	4	_aCircuits and Systems.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781461404620
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4614-0463-7
912			_aZDB-2-ENG
999			_c100857 _d100857