000 03404nam a22005295i 4500
001 978-1-4471-2470-2
003 DE-He213
005 20140220083235.0
007 cr nn 008mamaa
008 120109s2012 xxk| s |||| 0|eng d
020 _a9781447124702
_9978-1-4471-2470-2
024 7 _a10.1007/978-1-4471-2470-2
_2doi
050 4 _aT174.7
072 7 _aTDPB
_2bicssc
072 7 _aTEC027000
_2bisacsh
082 0 4 _a620.5
_223
100 1 _aLaurila, Tomi.
_eauthor.
245 1 0 _aInterfacial Compatibility in Microelectronics
_h[electronic resource] :
_bMoving Away from the Trial and Error Approach /
_cby Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti.
264 1 _aLondon :
_bSpringer London,
_c2012.
300 _aIX, 217p. 128 illus., 15 illus. in color.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aMicrosystems,
_x1389-2134
505 0 _aIntroduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures.
520 _aInterfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.    
650 0 _aEngineering.
650 0 _aOptical materials.
650 0 _aSurfaces (Physics).
650 1 4 _aEngineering.
650 2 4 _aNanotechnology and Microengineering.
650 2 4 _aSurfaces and Interfaces, Thin Films.
650 2 4 _aOptical and Electronic Materials.
700 1 _aVuorinen, Vesa.
_eauthor.
700 1 _aPaulasto-Kröckel, Mervi.
_eauthor.
700 1 _aTurunen, Markus.
_eauthor.
700 1 _aMattila, Toni T.
_eauthor.
700 1 _aKivilahti, Jorma.
_eauthor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781447124696
830 0 _aMicrosystems,
_x1389-2134
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4471-2470-2
912 _aZDB-2-ENG
999 _c100681
_d100681