| 000 | 03404nam a22005295i 4500 | ||
|---|---|---|---|
| 001 | 978-1-4471-2470-2 | ||
| 003 | DE-He213 | ||
| 005 | 20140220083235.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 120109s2012 xxk| s |||| 0|eng d | ||
| 020 |
_a9781447124702 _9978-1-4471-2470-2 |
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| 024 | 7 |
_a10.1007/978-1-4471-2470-2 _2doi |
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| 050 | 4 | _aT174.7 | |
| 072 | 7 |
_aTDPB _2bicssc |
|
| 072 | 7 |
_aTEC027000 _2bisacsh |
|
| 082 | 0 | 4 |
_a620.5 _223 |
| 100 | 1 |
_aLaurila, Tomi. _eauthor. |
|
| 245 | 1 | 0 |
_aInterfacial Compatibility in Microelectronics _h[electronic resource] : _bMoving Away from the Trial and Error Approach / _cby Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti. |
| 264 | 1 |
_aLondon : _bSpringer London, _c2012. |
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| 300 |
_aIX, 217p. 128 illus., 15 illus. in color. _bonline resource. |
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| 336 |
_atext _btxt _2rdacontent |
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| 337 |
_acomputer _bc _2rdamedia |
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| 338 |
_aonline resource _bcr _2rdacarrier |
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| 347 |
_atext file _bPDF _2rda |
||
| 490 | 1 |
_aMicrosystems, _x1389-2134 |
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| 505 | 0 | _aIntroduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures. | |
| 520 | _aInterfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike. | ||
| 650 | 0 | _aEngineering. | |
| 650 | 0 | _aOptical materials. | |
| 650 | 0 | _aSurfaces (Physics). | |
| 650 | 1 | 4 | _aEngineering. |
| 650 | 2 | 4 | _aNanotechnology and Microengineering. |
| 650 | 2 | 4 | _aSurfaces and Interfaces, Thin Films. |
| 650 | 2 | 4 | _aOptical and Electronic Materials. |
| 700 | 1 |
_aVuorinen, Vesa. _eauthor. |
|
| 700 | 1 |
_aPaulasto-Kröckel, Mervi. _eauthor. |
|
| 700 | 1 |
_aTurunen, Markus. _eauthor. |
|
| 700 | 1 |
_aMattila, Toni T. _eauthor. |
|
| 700 | 1 |
_aKivilahti, Jorma. _eauthor. |
|
| 710 | 2 | _aSpringerLink (Online service) | |
| 773 | 0 | _tSpringer eBooks | |
| 776 | 0 | 8 |
_iPrinted edition: _z9781447124696 |
| 830 | 0 |
_aMicrosystems, _x1389-2134 |
|
| 856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4471-2470-2 |
| 912 | _aZDB-2-ENG | ||
| 999 |
_c100681 _d100681 |
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