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3-Dimensional VLSI [electronic resource] : A 2.5-Dimensional Integration Scheme / by Yangdong Deng, Wojciech P. Maly.

By: Deng, Yangdong [author.].
Contributor(s): Maly, Wojciech P [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookPublisher: Berlin, Heidelberg : Springer Berlin Heidelberg, 2010Description: online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9783642041570.Subject(s): Engineering | Systems engineering | Engineering | Circuits and SystemsDDC classification: 621.3815 Online resources: Click here to access online
Contents:
A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work.
In: Springer eBooksSummary: "3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
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A Cost Comparison of VLSI Integration Schemes -- Design Case Studies -- An Automatic 2.5-D Layout Design Flow -- Floorplanning for 2.5-D Integration -- Placement for 2.5-D Integration -- A Road map of 2.5-D Integration -- Conclusion and Future Work.

"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.

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