Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Record no. 94490)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04050nam a22004455i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4419-9542-1 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20140220082803.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 121204s2013 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781441995421 |
| -- | 978-1-4419-9542-1 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-1-4419-9542-1 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7888.4 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJFC |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008010 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.3815 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Lim, Sung Kyu. |
| Relator term | author. |
| 245 10 - TITLE STATEMENT | |
| Title | Design for High Performance, Low Power, and Reliable 3D Integrated Circuits |
| Medium | [electronic resource] / |
| Statement of responsibility, etc | by Sung Kyu Lim. |
| 264 #1 - | |
| -- | New York, NY : |
| -- | Springer New York : |
| -- | Imprint: Springer, |
| -- | 2013. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | XXVIII, 560 p. 303 illus., 169 illus. in color. |
| Other physical details | online resource. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Regular vs Irregular TSV Placementfor 3D IC -- Steiner Routingfor 3D IC -- Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC -- Power Delivery Network Design for 3D IC -- 3D Clock Routing for Pre-bond Testability -- TSV-to-TSV Coupling Analysis and Optimization -- TSV Current Crowding and Power Integrity -- Modeling of Atomic Concentration at the Wire-to-TSV Interface -- Multi-Objective Archetectural Floorplanning for 3D IC -- Thermal-aware Gate-level Placement for 3D IC -- 3D IC Cooling with Micro-Fluidic Channels -- Mechanical Reliability Analysis and Optimization for 3D IC -- Impact of Mechanical Stress on Timing Variation for 3D IC -- Chip/Package Co-Analysis of Mechanical Stress for 3D IC -- 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations -- TSV Interfracial Crack Analysis and Optimization -- Ultra High Logic Designs Using Monolithic 3D Integration -- Impact of TSV Scaling on 3D IC Design Quality -- 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and full-chip timing variations, and the impact of package elements. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Computer science. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Systems engineering. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Nanotechnology and Microengineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Processor Architectures. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9781441995414 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4419-9542-1 |
| 912 ## - | |
| -- | ZDB-2-ENG |
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