MEMS and Nanotechnology, Volume 4 (Record no. 106221)

000 -LEADER
fixed length control field 04569nam a22004575i 4500
001 - CONTROL NUMBER
control field 978-1-4614-0210-7
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20140220083732.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 110520s2011 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781461402107
-- 978-1-4614-0210-7
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-1-4614-0210-7
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number T174.7
072 #7 - SUBJECT CATEGORY CODE
Subject category code TDPB
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC027000
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 620.5
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Proulx, Tom.
Relator term editor.
245 10 - TITLE STATEMENT
Title MEMS and Nanotechnology, Volume 4
Medium [electronic resource] :
Remainder of title Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics /
Statement of responsibility, etc edited by Tom Proulx.
264 #1 -
-- New York, NY :
-- Springer New York :
-- Imprint: Springer,
-- 2011.
300 ## - PHYSICAL DESCRIPTION
Extent VIII, 192 p.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
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-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
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490 1# - SERIES STATEMENT
Series statement Conference Proceedings of the Society for Experimental Mechanics Series,
International Standard Serial Number 2191-5644
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication -- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures -- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon -- Nano-tubes Reinforced Epoxy -- A Nano-tensile Tester for Creep Studies -- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing -- New Insight Into Pile-Up in Thin Film Indentation -- Measuring Substrate-independent Young’s Modulus of Thin Films -- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach -- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures -- Analytical Approach for the Determination of Nanomechanical Properties for Metals -- Advances in Thin Film Indentation -- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement -- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy -- Full-field Bulge Testing Using Global Digital Image Correlation -- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals -- Characterization of  a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial -- MEMS for Real-time Infrared Imaging -- New Insights Into Enhancing Microcantilever MEMS Sensors -- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer -- Micromechanical Structure With Stable Linear Positive and Negative Stiffness -- Terahertz Metamaterial Structures Fabricated by PolyMUMPs -- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths -- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies -- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending -- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis -- Analysis and Evaluation Methods Associated With the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies -- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire -- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems.
520 ## - SUMMARY, ETC.
Summary, etc MEMS and Nanotechnology represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011.  The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology and Microengineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Mechatronics.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9781461402091
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Conference Proceedings of the Society for Experimental Mechanics Series,
-- 2191-5644
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-1-4614-0210-7
912 ## -
-- ZDB-2-ENG

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