Lead Free Solder (Record no. 100857)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03529nam a22005055i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4614-0463-7 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20140220083238.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 111013s2012 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781461404637 |
| -- | 978-1-4614-0463-7 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-1-4614-0463-7 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7800-8360 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874-7874.9 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJF |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008070 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Pang, John Hock Lye. |
| Relator term | author. |
| 245 10 - TITLE STATEMENT | |
| Title | Lead Free Solder |
| Medium | [electronic resource] : |
| Remainder of title | Mechanics and Reliability / |
| Statement of responsibility, etc | by John Hock Lye Pang. |
| 264 #1 - | |
| -- | New York, NY : |
| -- | Springer New York, |
| -- | 2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | X, 175p. 162 illus. |
| Other physical details | online resource. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction -- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models -- Fatigue Life Prediction Models -- Finite Element Analysis and Design-For-Reliability -- Thermo-Mechanical Reliability Test and Analysis -- Dynamic Mechanical Reliability Test and Analysis -- Thermal Cycling Aging Effects on Board-Level Drop Test Result. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. This book also: Discusses the mechanical properties of the lead-free solder materials used in the industry Focuses on mechanics of materials theory inelastic, plastic, creep, fatigue and fracture assessments Presents materials testing and characterization for bulk solder, solder joint and soldered assembly Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact Lead Free Solder: Mechanics and Reliability is an ideal book for engineers working with semiconductor packaging and in the electronic manufacturing industry. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Materials. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Systems engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Optical materials. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Optical and Electronic Materials. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Continuum Mechanics and Mechanics of Materials. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Circuits and Systems. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9781461404620 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4614-0463-7 |
| 912 ## - | |
| -- | ZDB-2-ENG |
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