Electromigration Modeling at Circuit Layout Level (Record no. 100168)

000 -LEADER
fixed length control field 02668nam a22004935i 4500
001 - CONTROL NUMBER
control field 978-981-4451-21-5
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20140220082947.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 130321s2013 si | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9789814451215
-- 978-981-4451-21-5
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-981-4451-21-5
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TA169.7
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number T55-T55.3
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TA403.6
072 #7 - SUBJECT CATEGORY CODE
Subject category code TGPR
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC032000
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 658.56
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Tan, Cher Ming.
Relator term author.
245 10 - TITLE STATEMENT
Title Electromigration Modeling at Circuit Layout Level
Medium [electronic resource] /
Statement of responsibility, etc by Cher Ming Tan, Feifei He.
264 #1 -
-- Singapore :
-- Springer Singapore :
-- Imprint: Springer,
-- 2013.
300 ## - PHYSICAL DESCRIPTION
Extent IX, 103 p. 75 illus., 2 illus. in color.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
490 1# - SERIES STATEMENT
Series statement SpringerBriefs in Applied Sciences and Technology,
International Standard Serial Number 2191-530X
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion.
520 ## - SUMMARY, ETC.
Summary, etc Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.  Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. 
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element System safety.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Quality Control, Reliability, Safety and Risk.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronic Circuits and Devices.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Atomic, Molecular, Optical and Plasma Physics.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name He, Feifei.
Relator term author.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9789814451208
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title SpringerBriefs in Applied Sciences and Technology,
-- 2191-530X
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-981-4451-21-5
912 ## -
-- ZDB-2-ENG

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