Dziuban, Jan A.
Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban. - Dordrecht : Springer Netherlands, 2006. - digital. - Springer Series in Advanced Microelectronics, 24 1437-0387 ; . - Springer Series in Advanced Microelectronics, 24 .
9781402045899
10.1007/1-4020-4589-1 doi
Engineering.
Materials.
Structural control (Engineering).
Electronics.
Optical materials.
Engineering.
Continuum Mechanics and Mechanics of Materials.
Physics and Applied Physics in Engineering.
Optical and Electronic Materials.
Electronics and Microelectronics, Instrumentation.
Operating Procedures, Materials Treatment.
TA405-409.3 QA808.2
620.1
Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban. - Dordrecht : Springer Netherlands, 2006. - digital. - Springer Series in Advanced Microelectronics, 24 1437-0387 ; . - Springer Series in Advanced Microelectronics, 24 .
9781402045899
10.1007/1-4020-4589-1 doi
Engineering.
Materials.
Structural control (Engineering).
Electronics.
Optical materials.
Engineering.
Continuum Mechanics and Mechanics of Materials.
Physics and Applied Physics in Engineering.
Optical and Electronic Materials.
Electronics and Microelectronics, Instrumentation.
Operating Procedures, Materials Treatment.
TA405-409.3 QA808.2
620.1