Perkins, Andrew E.
Solder Joint Reliability Prediction for Multiple Environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman. - Boston, MA : Springer US, 2009. - digital.
9780387793948
10.1007/978-0-387-79394-8 doi
Engineering.
System safety.
Electronics.
Optical materials.
Materials.
Engineering.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.
Solder Joint Reliability Prediction for Multiple Environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman. - Boston, MA : Springer US, 2009. - digital.
9780387793948
10.1007/978-0-387-79394-8 doi
Engineering.
System safety.
Electronics.
Optical materials.
Materials.
Engineering.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.